What goes wrongThe existing gold lines are chipping and flaking away from the substrate, indicating that the adhesive layer has degraded or the mechanical bond has failed over time. Recognition is straightforward: visible loss of gold, lifting edges, and exposed urushi or substrate beneath the line.
What recovers itConsolidate any lifting sections by wicking a thin film of diluted ki-urushi along the edges of the remaining gold to re-adhere it, being careful not to flood the areas where new material will be joined. Then rebuild the missing portions of the line with successive coats of urushi to the original thickness before re-applying matched gold powder.